Recent improvements of the Kloften & Kloften
April 17, 2000
1. Multi-Purpose Splicer.
The introduction of the “Panel” mentioned in the previous “Recent Improvements” (No. 16, which follows enclosed), has made it possible to offer a splicer suitable for a number of operating modes, such as:
1 Splicing wide strips - butted, using silver solder.
2 Splicing wide strips with an overlap.
3 Welding single and double carrier strips.
To change from mode (1) to (2) requires changing the solder from wire to strip, and making a slight adjustment of the tooling bars.
To change to (3) requires a re-programming of the PLC and a changing of the right hand jaw set. To avoid re-programming, the splicer may be supplied with an extra PLC programmed for the second operating mode.
Note to (1):
The 0.25 mm dia. silver solder is confined between the two tape ends, resulting in an increase of the thickness of only 0 to 0.02 mm.
Note to (2):
Soldering with a slight overlap has proven well suited for leadframes for micro chips.
Since these frames are normally made from thin material, an overlap can be tolerated, resulting in a very reliable splice, with all the fine leads imbedded in the solder, thereby avoiding the problem with loose pieces. A number of such splicers have been in operation for up to three years, splicing leadframes 70 mm wide and 0.08 mm thick.
Note to (3):
Strips of stainless steel or Beryllium Copper do not lend themselves to soldering, since a flux would have been required. The welding mode should therefore be adopted for these materials. By using a minute overlap in connection with the seam welding process, the thickness increase may be kept as low as 2 to 5 hundreds of a millimeter, without the use of excessive compression force. Dual carrier strips made of stainless steel up to 125 mm wide are being spliced on a standard splicer equipped with extra wide jaws. Jaws for even wider strips may be supplied.